Westbond
4KE (Semi-Automatic Wire Bonder)
45º Wedge – Wedge
90º Feed – Deep Access Wire
90º Feed – Deep Access Ribbon
Single Ball / Ball – Stitch / Stitch on Ball
Tab
| SPECIFICATIONS | |||
| BOND AREA | |||
| ESD Protection | Conductive and dissipative | ||
| Bond Platform | 11” x 11” (280 mm x 280 mm) 20” x 20” (508 mm x 508 mm) optional Adjustable Height: 0.625" (15.9 mm) | ||
| Motorized Z Travel | 0.5” (12.7 mm) / 0.000208” (5.3µm) resolution | ||
| Motorized Y Travel | 0.5” (12.7 mm) / 0.000208” (5.3µm) resolution | ||
| Manual X and Y Travel | 0.625”sq (17.8 mm2) @ 8:1 ratio | ||
| WIRE AND TOOL CAPABILITY | |||
| Au / Al | 0.7 to 3 mil (18 to 75μm) | ||
| Ribbon | 0.5 x 2mil to 1 x 10 mil (12.5 x 50μm to 25μ x 250μm) | ||
| Cu Ball Bonding | 0.7 to 1.5 mil (18 to 38μm) | ||
| Spool | ½” standard; 2” optional | ||
| Tool Diameter | 1/16” (1.58 mm) | ||
| Shank Length | 0.750” (19 mm) standard for wedge bonding 0.625” (16 mm) standard for ball bonding | ||
| ULTRASONIC SYSTEM | |||
| ½ wave length, 63 KHz transducer, 110 KHz Optional | |||
| 8 bit, 4 watt PLL Ultrasonic Generator | |||
| Ultrasonic tool positioning utility | |||
| Low Power: 2.5 W; High Power: 4 W | |||
| BOND PARAMETERS | |||
| Bond Force | 10 – 250 grams (high/low programmable) | ||
| Bond Time | 0 – 999 ms | ||
| Ball Formation | Negative EFO, Missing ball detection via Open and Short error | ||
| FACILITY REQUIREMENTS | |||
| Power Supply | 100 – 120 / 220 – 240 VAC 50/60Hz (needs configuration) | ||
| 50 PSI clean dry air | |||
| Dimensions | 24.22” (615 mm) W x 22.29” (566 mm) D x x 11.00” (295mm) H | ||
| Weight | Crated with accessories: 165lbs (75 kg) Uncrated: 75lbs (34 kg) | ||